Banqiu Wu,Ajay Kumar,Sesh Ramaswami's 3D IC Stacking Technology PDF

By Banqiu Wu,Ajay Kumar,Sesh Ramaswami

The most up-to-date advances in third-dimensional built-in circuit stacking technology

With a spotlight on business functions, 3D IC Stacking Technology deals entire insurance of layout, attempt, and fabrication processing equipment for third-dimensional gadget integration. each one bankruptcy during this authoritative advisor is written through specialists and info a separate fabrication step. destiny purposes and state-of-the-art layout capability also are mentioned. this can be an important source for semiconductor engineers and transportable equipment designers.

3D IC Stacking Technology covers:

  • High density via silicon stacking (TSS) technology
  • Practical layout surroundings for heterogeneous 3D IC products
  • Design automation and TCAD software options for via silicon through (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper electrodeposition for TSV
  • Chemical mechanical sprucing for TSV applications
  • Temporary and everlasting bonding
  • Assembly and attempt points of TSV technology

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3D IC Stacking Technology by Banqiu Wu,Ajay Kumar,Sesh Ramaswami

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